스택 패키지

Stack package

Abstract

본 발명의 일 실시예에 따른 스택 패키지는, 전기적인 연결을 위한 재배선의 일측 단부를 포함하는 다수의 관통홀을 구비한 반도체 칩; 상기 반도체 칩 상에 배치되고, 상기 반도체 칩의 관통홀 내에 삽입됨과 아울러 상기 반도체 칩의 하부로 돌출되도록 연장된 아웃터리드를 구비한 TSOP 타입 패키지; 및 상기 반도체 칩의 관통홀 내에 매립되어 상기 TSOP 타입 패키지의 아웃터리드와 상기 반도체 칩의 재배선 간을 전기적으로 연결시키는 전도성 물질을 포함한다.
A stacked package is provided to perform easily an exchange process in an abnormal state by forming a structure to be connected with a conductive material on a semiconductor chip. A stacked package includes a semiconductor chip(100), a TSOP type package(110), and a conductive material(104). A semiconductor chip includes a plurality of penetration holes(T). The penetration hole includes one end of a redistribution line for electrical connection. The TSOP type package is arranged on the semiconductor chip. The TSOP type package includes an outer lead(126). The outer lead is inserted into the penetration hole of the semiconductor chip. The outer lead is protruded to a lower part of the semiconductor chip. A conductive material is buried into the penetration hole of the semiconductor chip. The outer lead of the TSOP type package is connected with the redistribution line of the semiconductor chip.

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